Surface mountable power components
US9362221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2015 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Apr 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an exemplary implementation, a power component includes a component substrate and a power semiconductor device electrically and mechanically coupled to the component substrate. The power component also includes at least one first peripheral contact and at least one second peripheral contact situated on the component substrate. A power semiconductor device is situated between the at least one first peripheral contact and the at least one second peripheral contact. The at least one first peripheral contact, the at least one second peripheral contact, and a surface electrode of the power semiconductor device are configured for surface mounting. The at least one first peripheral contact can be electrically coupled to the power semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.