Vertical sensor assembly method
US8703543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2009 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Jun 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.