Samuel Broydo
10Patents
9h-index
11Co-inventors
65Inventor score
Filing activity: May 3, 1993 → Jul 21, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7110629B2 | Optical ready substrates | Electricity | 297 | Expired |
| US7043106B2 | Optical ready wafers | Physics | 275 | Expired |
| US6548396B2 | Method of producing an interconnect structure for an integrated circuit | Electricity | 174 | Expired |
| US6245662A | Method of producing an interconnect structure for an integrated circuit | Electricity | 83 | Expired |
| US5689133A | ESD protection circuit | Electricity | 48 | Expired |
| US5623387A | ESD protection circuit | Electricity | 46 | Expired |
| US5477414A | ESD protection circuit | Electricity | 42 | Expired |
| US5646814A | Multi-electrode electrostatic chuck | Electricity | 31 | Expired |
| US6514671B1 | Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics | Electricity | 17 | Expired |
| US7072534B2 | Optical ready substrates | Physics | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.