Samuel Wilson
4Patents
4h-index
19Co-inventors
40Inventor score
Filing activity: Nov 29, 1996 → Mar 17, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6110530A | CVD method of depositing copper films by using improved organocopper precursor blend | Chemistry; Metallurgy | 245 | Expired |
| US5740009A | Apparatus for improving wafer and chuck edge protection | Electricity | 73 | Expired |
| US6464790B1 | Substrate support member | Electricity | 67 | Expired |
| US6319728A | Method for treating a deposited film for resistivity reduction | Electricity | 26 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.