Sayan Seal
4Patents
1h-index
10Co-inventors
34Inventor score
Filing activity: Jan 30, 2018 → Jan 27, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10784235B2 | Silicon carbide power module | Electricity | 3 | Active |
| US10720380B1 | Flip-chip wire bondless power device | Electricity | 0 | Active |
| US12224233B2 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Electricity | 0 | Active |
| USD909310S1 | Power module | General | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.