Apparatus and method for arranging devices for processing
US7726540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2005 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jun 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.