Senol Pekin
5Patents
4h-index
6Co-inventors
39Inventor score
Filing activity: Aug 11, 2000 → Jan 14, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6700207B2 | Flip-chip ball grid array package for electromigration testing | Electricity | 10 | Expired |
| US6466038B1 | Non-isothermal electromigration testing of microelectronic packaging interconnects | Physics | 8 | Expired |
| US6818996B2 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Electricity | 6 | Expired |
| US7065721B2 | Optimized bond out method for flip chip wafers | Physics | 5 | Expired |
| US6403399B1 | Method of rapid wafer bumping | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.