Flip-chip ball grid array package for electromigration testing
US6700207B2 · kind B2 · utility
10Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Aug 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A test package for electromigration testing includes a die having a plurality of I/O pads formed on a metal layer, a plurality of traces formed on the die electrically connecting adjacent pairs of the I/O pads, a plurality of bumped interconnects formed on the I/O pads, and a substrate having a plurality of bump-to-bump interconnects formed on a top surface of the substrate adjacent to the die wherein the plurality of bump-to-bump interconnects is electrically coupled to the plurality of bumped interconnects so that the plurality of bumped interconnects is connected in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.