Sesh Ramaswami
4Patents
3h-index
17Co-inventors
47Inventor score
Filing activity: Aug 24, 1998 → Dec 23, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6362099B1 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Electricity | 41 | Expired |
| US8283237B2 | Fabrication of through-silicon vias on silicon wafers | Electricity | 8 | Active |
| US7294242B1 | Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications | Electricity | 4 | Expired |
| US8329575B2 | Fabrication of through-silicon vias on silicon wafers | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.