Shin-Kung CHEN
4Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Aug 14, 2012 → Sep 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8703508B2 | Method for wafer-level testing diced multi-chip stacked packages | Electricity | 14 | Active |
| US11693043B2 | Test head assembly for semiconductor device | Physics | 0 | Active |
| US11608205B2 | Head of a tag device | Performing Operations; Transporting | 0 | Active |
| US9250288B2 | Wafer-level testing method for singulated 3D-stacked chip cubes | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.