Inventor · Tokyo, JP

Shinsuke Sakai

6Patents
4h-index
12Co-inventors
54Inventor score

Filing activity: Mar 18, 1986 → Jun 1, 2012

Most-cited inventions

PatentTitleAreaCited byStatus
US5096854A Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns Emerging Cross-Sectional Technologies 37 Expired
US5459104A Process for production of semiconductor substrate Emerging Cross-Sectional Technologies 31 Expired
US5337232A Morpheme analysis device Physics 24 Expired
US6199680A Method and apparatus for bunching PTPs and for transferring the bunched-PTPs Performing Operations; Transporting 8 Expired
US4699118A Apparatus for dressing cutting edge Performing Operations; Transporting 4 Expired
US9181557B2 Uracil-requiring moorella bacteria and transforming-gene-introduced moorella bacteria Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.