Image sensor package including reflector
US11387270B2 · kind B2 · utility
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11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Feb 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.