Simon Dong
2Patents
0h-index
9Co-inventors
21Inventor score
Filing activity: Sep 30, 2021 → Feb 14, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12062625B2 | Semiconductor device package mold flow control system and method | Electricity | 0 | Active |
| US11942459B2 | Semiconductor device package with exposed bond wires | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.