SooSan Park
3Patents
3h-index
9Co-inventors
39Inventor score
Filing activity: May 12, 2011 → Mar 13, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9312218B2 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | Electricity | 5 | Active |
| US10418332B2 | Semiconductor device and method of forming partition fence and shielding layer around semiconductor components | Electricity | 4 | Active |
| US9859200B2 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.