Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
US9859200B2 · kind B2 · utility
4Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2015 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jul 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.