Inventor · San Ramon, CA, US

Steve Anderson

29Patents
12h-index
21Co-inventors
77Inventor score

Filing activity: Oct 10, 2003 → Apr 7, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7416549B2 Multi-zone bipolar ablation probe assembly Human Necessities 134 Expired
US7670336B2 Ablation probe with heat sink Human Necessities 68 Active
US9119732B2 Method and implant system for sacroiliac joint fixation and fusion Human Necessities 37 Active
USD905232S1 Surgical cannula General 35 Active
US9993278B2 Co-access bipolar ablation probe Human Necessities 30 Active
US10321945B2 Method and implant system for sacroiliac joint fixation and fusion Human Necessities 29 Active
US8007497B2 Ablation probe with heat sink Human Necessities 29 Active
US10426539B2 Method and implant system for sacroiliac joint fixation and fusion Human Necessities 24 Active
US7959629B2 Multi-zone bipolar ablation probe assembly Human Necessities 24 Active
USD922568S1 Surgical cannula General 23 Active
US10993757B2 Method and implant system for sacroiliac joint fixation and fusion Human Necessities 22 Active
USD972137S1 Surgical rasp General 20 Active
USD935025S1 Helical implant General 11 Active
US8414580B2 Co-access bipolar ablation probe Human Necessities 11 Active
USD921898S1 Helical implant General 10 Active
USD919087S1 Surgical tool General 8 Active
USD952147S1 Joint finder General 8 Active
USD742517S1 Surgical implant General 6 Active
USD742008S1 Blade implant General 5 Active
US9240331B2 Semiconductor device and method of making bumpless flipchip interconnect structures Electricity 4 Active
US9287204B2 Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Electricity 4 Active
US11083511B2 Method and implant system for sacroiliac joint fixation and fusion Human Necessities 4 Active
US9245770B2 Semiconductor device and method of simultaneous molding and thermalcompression bonding Electricity 3 Active
US9721921B2 Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Electricity 1 Active
US9553162B2 Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.