Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
US9553162B2 · kind B2 · utility
1Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Apr 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.