Suixin Zhang
2Patents
2h-index
10Co-inventors
34Inventor score
Filing activity: Dec 19, 1997 → Apr 24, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6548327B2 | Low cost electroless plating process for single chips and wafer parts and products obtained thereof | Electricity | 15 | Expired |
| US6036836A | Process to create metallic stand-offs on an electronic circuit | Electricity | 15 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.