SunYoung Chun
5Patents
3h-index
9Co-inventors
42Inventor score
Filing activity: Aug 1, 2008 → May 17, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8004093B2 | Integrated circuit package stacking system | Electricity | 35 | Active |
| US8432028B2 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Electricity | 6 | Active |
| US8932908B2 | Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die | Electricity | 4 | Active |
| US8288202B2 | Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die | Electricity | 1 | Active |
| US8502392B2 | Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.