Inventor · Takasaki, JP

Takashi Ooba

2Patents
1h-index
5Co-inventors
41Inventor score

Filing activity: Dec 22, 1992 → Sep 16, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US5304512A Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process Emerging Cross-Sectional Technologies 35 Expired
US10146247B2 Reaction force output device Physics 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.