Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process
US5304512A · kind A · utility
35Cited by
0References
61Claims
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Assignee
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Key dates
| Filing date | Dec 22, 1992 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Dec 22, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of a resin, by introducing a molding compound sheet 20 into the cavities 33 of molds 31, 32 before the molds are clamped, by melting the molding compound sheet 20 in the cavities 33 into a liquid molding material 45 after the mold clamping action to pressure fill up the inside of the cavities 33, and by setting the liquid molding material 45 integrally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.