Tetsu Oosawa
7Patents
7h-index
10Co-inventors
52Inventor score
Filing activity: Mar 26, 1992 → Apr 27, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5340261A | Load-lock unit and wafer transfer system | Emerging Cross-Sectional Technologies | 363 | Expired |
| US5445486A | Substrate transferring apparatus | Emerging Cross-Sectional Technologies | 67 | Expired |
| US5405230A | Load-lock unit and wafer transfer system | Emerging Cross-Sectional Technologies | 45 | Expired |
| US5435683A | Load-lock unit and wafer transfer system | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6032083A | Substrate transfer apparatus and heat treatment system using the same | Electricity | 19 | Expired |
| US6358324B1 | Microwave plasma processing apparatus having a vacuum pump located under a susceptor | Electricity | 12 | Expired |
| US5984607A | Transfer apparatus, transfer method, treatment apparatus and treatment method | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.