Substrate transfer apparatus and heat treatment system using the same
US6032083A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 8, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Dec 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate transfer apparatus (20) transfers a substrate between a first substrate support member (21) for supporting a plurality of substrates and a second substrate support member (15). This apparatus (20) includes a transfer apparatus main body (60) movable between a first transfer operation position where it can perform a substrate transfer operation with respect to the first substrate support member, and a second transfer operation position where it can perform a substrate transfer operation with respect to second substrate support member, a substrate receiving member (59b) arranged to be movable back and forth with respect to the transfer apparatus main body to support the substrate and to transfer the substrate to/from the first or second substrate support member, and non-contact sensors (70a, 70b) mounted on two side portions of the substrate receiving member (59b) and movable back and forth integrally with the substrate receiving member to detect a distance to the substrate and a position of the substrate in a horizontal plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.