Microwave plasma processing apparatus having a vacuum pump located under a susceptor
US6358324B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Apr 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microwave plasma processing apparatus has a process chamber in which an object to be processed is subjected to plasma processing under a predetermined negative pressure environment. A susceptor holding the object thereon is provided in the process chamber. The susceptor is moved by a susceptor moving member which is moved by a susceptor moving mechanism located outside the process chamber. The susceptor moving member extends from the process chamber via a bellows provided to a bottom of the process chamber. The bellows allows a vertical movement of the susceptor moving member while providing a hermetic seal to the process chamber to maintain the predetermined negative pressure environment in the process chamber. A vacuum pump is provided to the bottom of the process chamber so that an inlet opening of the vacuum pump aligns with the susceptor in the vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.