Tetsu Takemasa
4Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Aug 17, 2017 → Jun 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11097379B2 | Solder bonding method and solder joint | Emerging Cross-Sectional Technologies | 0 | Active |
| US11024598B2 | Metallic sintered bonding body and die bonding method | Electricity | 0 | Active |
| US11628519B2 | Solder joint | Emerging Cross-Sectional Technologies | 0 | Active |
| US11710580B2 | Electrically conductive paste and sintered body | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.