Metallic sintered bonding body and die bonding method
US11024598B2 · kind B2 · utility
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1References
17Claims
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Key dates
| Filing date | Aug 17, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Aug 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.