Tetsuro Iwakura
2Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Apr 20, 2005 → Apr 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8017444B2 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Emerging Cross-Sectional Technologies | 3 | Active |
| US11905412B2 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.