Adhesive sheet, semiconductor device, and process for producing semiconductor device
US8017444B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2005 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Sep 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.