Process for forming metallic film on inorganic material
US4842899A · kind A · utility
1Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1987 |
| Grant date | Jun 27, 1989 |
| Priority date | — |
| Expiry date | Mar 31, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metallic film can be formed on a ceramic surface with high adhesive strength by roughening the ceramic surface by (a) dissolving and removing a vitreous substance and (b) roughening a substance constituting mainly a first surface layer, followed by conventional electroless plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.