Thy Tran
4Patents
2h-index
8Co-inventors
37Inventor score
Filing activity: Mar 10, 2010 → Oct 14, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8716116B2 | Method of forming a DRAM array of devices with vertically integrated recessed access device and digitline | Electricity | 23 | Active |
| US9613864B2 | Low capacitance interconnect structures and associated systems and methods | Electricity | 2 | Active |
| US12272167B2 | Systems and methods for automated acceptance of form documents | Physics | 0 | Active |
| US9911653B2 | Low capacitance interconnect structures and associated systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.