Tie Wang
6Patents
4h-index
14Co-inventors
50Inventor score
Filing activity: Sep 21, 2000 → Feb 6, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7087458B2 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Electricity | 55 | Expired |
| US6467676B1 | Fluxing adhesive | Electricity | 20 | Expired |
| US6365435B1 | Method for producing a flip chip package | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7153725B2 | Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor | Electricity | 11 | Expired |
| US9291758B2 | Laterally aligned colloidal nanorods assemblies | Emerging Cross-Sectional Technologies | 1 | Active |
| US10310278B2 | Semiconductor laser | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.