Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
US7153725B2 · kind B2 · utility
11Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jun 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.