Timothy E. Dearden
4Patents
3h-index
9Co-inventors
47Inventor score
Filing activity: Dec 3, 1987 → Sep 10, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6417747B1 | Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards | Electricity | 20 | Expired |
| US4866837A | Dual port alignment assembly station for attaching components to circuit boards | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7605477B2 | Stacked integrated circuit assembly | Electricity | 5 | Active |
| US7888176B2 | Stacked integrated circuit assembly | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.