Tomas Bauer
5Patents
2h-index
2Co-inventors
33Inventor score
Filing activity: Jan 31, 2007 → Jan 12, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9362139B2 | Method of making a semiconductor device having a functional capping | Electricity | 5 | Active |
| US8324103B2 | Vias and method of making | Electricity | 2 | Active |
| US9620390B2 | Method of making a semiconductor device having a functional capping | Electricity | 1 | Active |
| US8598676B2 | Barrier structure | Electricity | 0 | Active |
| US9312217B2 | Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.