Tomoaki Kudaishi
23Patents
10h-index
46Co-inventors
71Inventor score
Filing activity: Jul 10, 1998 → Mar 24, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6169325A | Semiconductor device | Emerging Cross-Sectional Technologies | 50 | Expired |
| US7706756B2 | RF power module | Electricity | 36 | Active |
| US6521981B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US7420284B2 | Semiconductor device and manufacturing method thereof | Electricity | 29 | Active |
| US6307269A | Semiconductor device with chip size package | Electricity | 25 | Expired |
| US6342726B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6670215B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6342728B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6472727B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6642083B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7995984B2 | Semiconductor device | Electricity | 10 | Active |
| US6365439B2 | Method of manufacturing a ball grid array type semiconductor package | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7091620B2 | Semiconductor device and manufacturing method thereof | Electricity | 8 | Expired |
| US6515371B2 | Semiconductor device with elastic structure and wiring | Electricity | 7 | Expired |
| US7223636B2 | Manufacturing method of semiconductor device and semiconductor device | Electricity | 6 | Expired |
| US6355500B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6353255B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6664135B2 | Method of manufacturing a ball grid array type semiconductor package | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7962105B2 | RF power module | Electricity | 3 | Active |
| US6355975B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6639323B2 | Semiconductor device and its manufacturing method | Electricity | 2 | Expired |
| US6875631B2 | Semiconductor device and a method of manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6759754B1 | Semiconductor device and its manufacturing method | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.