Manufacturing method of semiconductor device and semiconductor device
US7223636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Oct 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.