Semiconductor device and manufacturing method thereof
US6521981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.