Inventor · Tokyo, JP

Tomoko Owada

14Patents
4h-index
11Co-inventors
49Inventor score

Filing activity: Jun 9, 2017 → Apr 19, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
USD839224S1 Elastic membrane for semiconductor wafer polishing General 27 Active
USD859332S1 Elastic membrane for semiconductor wafer polishing General 10 Active
USD913977S1 Elastic membrane for semiconductor wafer polishing General 5 Active
USD989012S1 Elastic membrane General 4 Active
US11179823B2 Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane Performing Operations; Transporting 2 Active
USD918161S1 Elastic membrane General 1 Active
US11088011B2 Elastic membrane, substrate holding device, and polishing apparatus Performing Operations; Transporting 1 Active
US11958163B2 Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane Electricity 1 Active
US11731235B2 Polishing apparatus and polishing method Performing Operations; Transporting 0 Active
US11745306B2 Polishing apparatus and method of controlling inclination of stationary ring Performing Operations; Transporting 0 Active
USD1021832S1 Elastic membrane General 0 Active
US12068189B2 Elastic membrane, substrate holding device, and polishing apparatus Performing Operations; Transporting 0 Active
USD981969S1 Elastic membrane for semiconductor wafer polishing apparatus General 0 Active
US11654524B2 Method of detecting abnormality of a roller which transmits a local load to a retainer ring, and polishing apparatus Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.