Polishing apparatus and polishing method
US11731235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Dec 22, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing apparatus includes: a polishing table configured to support a polishing pad having a polishing surface; a rotatable head body having a pressing surface; a retainer ring configured to press the polishing surface and rotatable together with the head body; a rotary ring; a stationary ring; and local-load exerting devices each configured to apply a local load to the stationary ring. The local-load exerting devices include a first pressing member and a second pressing member coupled to the stationary ring. The first pressing member is arranged at an upstream side of the retainer ring in a moving direction of the polishing surface, and the second pressing member is arranged at a downstream side of the retainer ring in the moving direction of the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.