Elastic membrane for semiconductor wafer polishing apparatus
USD981969S1 · kind S1 · design
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13References
1Claims
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Key dates
| Filing date | Jun 15, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Mar 28, 2038 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.