Tsukui Seiichiro
7Patents
6h-index
4Co-inventors
52Inventor score
Filing activity: Nov 25, 1991 → Jan 14, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5138438A | Lead connections means for stacked tab packaged IC chips | Electricity | 316 | Expired |
| US5587341A | Process for manufacturing a stacked integrated circuit package | Electricity | 56 | Expired |
| US6262488A | Semiconductor memory module having double-sided memory chip layout | Electricity | 53 | Expired |
| US5708298A | Semiconductor memory module having double-sided stacked memory chip layout | Electricity | 47 | Expired |
| US6424030B2 | Semiconductor memory module having double-sided stacked memory chip layout | Electricity | 12 | Expired |
| US6521993B2 | Semiconductor memory module having double-sided stacked memory chip layout | Electricity | 9 | Expired |
| US6693346B2 | Semiconductor memory module having double-sided stacked memory chip layout | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.