Vicky Liu
7Patents
4h-index
26Co-inventors
57Inventor score
Filing activity: Oct 12, 1999 → May 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6246115A | Semiconductor package having a heat sink with an exposed surface | Electricity | 108 | Expired |
| US6552428B1 | Semiconductor package having an exposed heat spreader | Electricity | 84 | Expired |
| US6265763A | Multi-chip integrated circuit package structure for central pad chip | Electricity | 44 | Expired |
| US10243846B2 | Defining routing domain for distributed packet processing | Electricity | 38 | Active |
| US11005753B2 | Defining routing domain for distributed packet processing | Electricity | 1 | Active |
| US9258379B2 | Session initiation protocol adapter system and method providing stateless node mapping to a stateful server node hosting a communication session for an actor | Electricity | 1 | Active |
| US11736391B2 | Defining routing domain for distributed packet processing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.