Vikas Dubey
5Patents
3h-index
8Co-inventors
39Inventor score
Filing activity: Dec 19, 2014 → Oct 31, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9978710B2 | Method for self-aligned solder reflow bonding and devices obtained thereof | Electricity | 12 | Active |
| US9601459B2 | Method for aligning micro-electronic components | Electricity | 8 | Active |
| US10192009B2 | Simulation of photovoltaic modules | Emerging Cross-Sectional Technologies | 3 | Active |
| US10797016B2 | Method for bonding semiconductor chips to a landing wafer | Electricity | 0 | Active |
| US9799632B2 | Method for aligning micro-electronic components | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.