Method for fabricating a lid for a wafer level packaged optical MEMS device
US6856014B1 · kind B1 · utility
34Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2003 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Dec 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00333
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of individually packaging a multiplicity of devices, such as a spatial light modulator, before the multiplicity of devices formed on a substrate wafer are separated. The method and structure comprises individually sealing each device while the device is still part of sealed by the combination interposer wafer and a cover or window wafer. After each device is sealed by the combination interposer wafer and cover wafer, the combination cover wafer is sawed through down to the substrate wafer. The sealed devices may then be fully separated by scoring and breaking the substrate wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.