Vincent Malba
6Patents
6h-index
4Co-inventors
45Inventor score
Filing activity: Feb 13, 1995 → Dec 7, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5834162A | Process for 3D chip stacking | Emerging Cross-Sectional Technologies | 111 | Expired |
| US5933712A | Attachment method for stacked integrated circuit (IC) chips | Electricity | 56 | Expired |
| US6417754B1 | Three-dimensional coil inductor | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5653019A | Repairable chip bonding/interconnect process | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5632434A | Pressure activated diaphragm bonder | Performing Operations; Transporting | 34 | Expired |
| US6114097A | 3-D laser patterning process utilizing horizontal and vertical patterning | Physics | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.