Wanchun Ding
3Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Oct 24, 2012 → Nov 24, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9515010B2 | Semiconductor packaging structure and forming method therefor | Electricity | 1 | Active |
| US8890320B2 | Via arrangement and semiconductor device with the via arrangement | Electricity | 0 | Active |
| US10008478B2 | Fabricating method for wafer-level packaging | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.