Wei-Min Chen
11Patents
4h-index
36Co-inventors
60Inventor score
Filing activity: Jul 12, 1996 → May 24, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5834068A | Wafer surface temperature control for deposition of thin films | Chemistry; Metallurgy | 48 | Expired |
| US6471464B1 | Wafer positioning device | Emerging Cross-Sectional Technologies | 14 | Expired |
| US8536684B2 | Method of assembling shielded integrated circuit device | Emerging Cross-Sectional Technologies | 7 | Active |
| US8096211B2 | Digital power torque wrench of indirect transmission | Performing Operations; Transporting | 6 | Active |
| US9423912B2 | Touch panel | Physics | 2 | Active |
| US12252448B1 | Engineered stone and manufacturing method thereof | Chemistry; Metallurgy | 0 | Active |
| US12000044B2 | Catalyzed deposition of metal films | Chemistry; Metallurgy | 0 | Active |
| US11686658B2 | Friction and wear test device with pin-on-plate differential temperature distribution and self-adaptive adjustment | Physics | 0 | Active |
| US12326312B1 | Bullpup conversion kit and gun including the same | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US8541870B1 | Semiconductor package utilizing tape to reinforce fixing of leads to die pad | Electricity | 0 | Active |
| US10443695B2 | Linear actuator | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.