Patent · US Active

Method of assembling shielded integrated circuit device

US8536684B2 · kind B2 · utility

7Cited by

12References

12Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Wei-Min Chen · Baoshan, TW
Zhigang Bai · Milpitas, US
Zhijie Wang · 梅厂镇, CN

Key dates

Filing date	Apr 22, 2011
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Nov 23, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.