Catalyzed deposition of metal films
US12000044B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Aug 4, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45544
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of depositing a metal film with high purity are discussed. Some embodiments utilize a thermal ALD process comprising an alkyl halide and a metal precursor. Some embodiments selectively deposit a metal film with high purity on a metal surface over a dielectric surface. Some embodiments selectively deposit a metal film with high purity on a dielectric surface over a metal surface. Some embodiments deposit a metal film with greater than 99% metal atoms on an atomic basis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.