Weiyuan YANG
2Patents
0h-index
6Co-inventors
21Inventor score
Filing activity: Jul 24, 2020 → Sep 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11114310B1 | Embedded packaging method capable of realizing heat dissipation | Electricity | 0 | Active |
| US12402414B2 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.